Annual FOPLP and Glass Substrate Packaging Report

Artificial intelligence (AI) semiconductors are becoming so complex and large that chip makers and packaging suppliers are turning to glass substrates. This trend could be a major boon to display makers, display equipment suppliers and display materials producers. It is also an ideal solution for under-utilized older a-Si TFT LCD fabs which could be converted or sold for this application. Advantages of glass substrates include superior flatness and better thermal and mechanical stability which will allow for higher density and higher performance chip packages to support AI. Glass substrates enable more transistors to be connected in a single package and also enable the ability to assemble larger configurations of chiplets. Organic materials used in packaging will likely reach their limit by 2030 , they consume more energy than glass and also have expansion and warpage limitations. A growing number of panel, equipment and materials suppliers have already announced programs in glass substrate packaging. TSMC announced CoWoS-R (organic interposer) for AI applications that glass substrate packaging will be adopted will be released in 2027. Intel has said it is targeting glass substrate package solutions in the second half of the decade. BOE has said they intend to start producing glass substrate packages in 2026 and JDI also mentioned they have started engaging in glass substrate packaging as an ASP (advanced semiconductor packaging) in its Q2’24 earnings call.

To respond to this market opportunity, DSCC has developed a report on the glass substrate packaging market entitled Annual FOPLP and Glass Substrate Packaging Report. The report will be available by the end of the year and will cover:

• An Overview of Semiconductor and FOPLP
• FOPLP & GSP Market Outlook
• Key Technologies and Challenges for FOPLP
• Status of Key FOPLP Players
• Supply Chain for Key FOPLP Players
• FOPLP Market Forecast
• Other Advanced Packaging Technologies

Table of Contents

Executive Summary p.4

An Overview of Semiconductor Packaging p.13

FOPLP & GSP Market Outlook p.38

• Key Technologies and Challenges of FOPLP p.52
• Process Flow p.53
• Key Equipment & Materials p. 98
• Process Challenges p.128

Status of Key FOPLP Players p.135

Supply Chain p.166

• Foundry
• Outsourced Semiconductor Assembly and Test (OSAT) Suppliers
• Panel Makers
• Substrate Suppliers

FOPLP Supply/Demand Forecast p.178

• Supply Forecast p. 179
• Demand Forecast p. 182

Other ASP Technologies p.191

• Chip on Wafer on Substrate (CoWoS) p.192
• Co-Packaged Optics (CPO) p.199

Glossary p.204